Single-Crystalline Silicon Layer Transfer to a Flexible Substrate Using Wafer Bonding

Journal article

Peer reviewed

KI YEOL KI YEOL BYUN, Isabelle FERAIN, Scott SONG, Susan HOLL and Cindy COLINGE

Journal of electronic materials, Vol.39(10), pp.2233-2236

2010

Handle:

https://hdl.handle.net/20.500.12741/rep:5142

Abstract

Electronics

Applied sciences

Exact sciences and technology

Materials

Microelectronic fabrication (materials and surfaces technology)

Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices

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Title: Single-Crystalline Silicon Layer Transfer to a Flexible Substrate Using Wafer Bonding
Creators: KI YEOL KI YEOL BYUN - Tyndall National Institute, University College Cork, Dyke Parade, Cork, Ireland
Isabelle FERAIN - Tyndall National Institute, University College Cork, Dyke Parade, Cork, Ireland
Scott SONG - Department of Electrical and Electronic Engineering, California State University, Sacramento, Sacramento, CA 95819, United States
Susan HOLL - Department of Mechanical Engineering, California State University, Sacramento, Sacramento, CA 95819, United States
Cindy COLINGE - Tyndall National Institute, University College Cork, Dyke Parade, Cork, Ireland
Academic Unit: Mechanical Engineering Department
Publisher: Springer; Heidelberg
Publication Details: 2010
Identifiers: 99257847100001671; https://hdl.handle.net/20.500.12741/rep:5142; https://doi.org/10.1007/s11664-010-1264-7
Language: English