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Reaction Dynamics of Activated Hydrophobic Silicon for Low-Temperature Wafer Bonding
Journal article

Reaction Dynamics of Activated Hydrophobic Silicon for Low-Temperature Wafer Bonding

M. P Breninford, C. A Colinge, S. L Holl, K. D Hobart and F. J Kub
Journal of the Electrochemical Society, Vol.156(5), pp.H303-H306
2009
Handle:
https://hdl.handle.net/20.500.12741/rep:5006

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