Plasma Assisted Low-Temperature Hydrophobic Wafer Bonding

Journal article

Michael P Breninford, David Bailey, Hamid Ikram, C. A Colinge and Susan Holl

ECS transactions, Vol.3(6), pp.181-188

12/21/2019

Handle:

https://hdl.handle.net/20.500.12741/rep:5828

Metrics

5 Record Views

Title: Plasma Assisted Low-Temperature Hydrophobic Wafer Bonding
Creators: Michael P Breninford
David Bailey
Hamid Ikram
C. A Colinge
Susan Holl
Academic Unit: Mechanical Engineering Department
Publication Details: 12/21/2019
Identifiers: 99257847417501671; https://hdl.handle.net/20.500.12741/rep:5828; https://doi.org/10.1149/1.2357068
Language: English